In semiconductor wafer manufacturing, the lithography process is a critical, precision-driven step that determines chip yield. As the “core of exposure and imaging” in the wafer fabrication process, lithography encompasses the entire workflow—including spin coating, exposure, development, etching, and wet cleaning—and imposes extremely stringent requirements on environmental cleanliness, impurity control, electrostatic protection, and chemical resistance. Micron-level dust particles, trace ion migration, and transient electrostatic discharges can all directly cause photoresist defects, pattern misalignment, wafer oxidation, and micro-short circuits in circuits, leading to the scrapping of entire wafers and resulting in massive production losses. Many FABs struggle to improve the yield of their photolithography processes. Even when equipment, processes, and environmental parameters are all in order, the bottleneck often lies in seemingly insignificant hand protection consumables. Ordinary Class 1,000 or industrial-grade cleanroom gloves are completely unsuitable for the ultra-high standards of the photolithography process.
Why Is the Use of Ordinary Cleanroom Gloves Strictly Prohibited in the Lithography Process?
Powder residue causes photoresist contamination
Excessive sulfur and chloride ions corrode the circuits on the wafers
Static electricity got out of control, causing a breakdown in a precision photolithography wafer
Flaking and shedding, leading to foreign matter defects in the manufacturing process
LjieClean Class 100 Powder-Free Nitrile Gloves
Suzhou Leader is focusing on the semiconductor wafer manufacturing sector and addressing pain points in the lithography process, we have developed specialized Class 100 powder-free, low-outgassing nitrile gloves that perfectly meet the production requirements of the entire wafer lithography process, making them the preferred protective consumables for numerous fabs and wafer packaging and testing companies.
1.Dichloride-Based Powder-Free Process: no Powder Contamination in the Photolithography Process
Utilizing a semiconductor-specific chlorination purification process, this method requires no addition of auxiliary additives such as talc, cornstarch, or silicone oil throughout the entire process. It ensures smooth application through the process itself, eliminating powder particles and silicone oil residue that contaminate photoresist at the source, thereby completely resolving foreign particle defects in the photolithography process.
2 Multi-stage ultrapure water rinsing achieves low sulfur, low chlorine, and low ion content
Through multiple cycles of deep rinsing with high-purity water, raw material additives and surface residues are removed. The content of sulfur, chlorine, and soluble metal ions is strictly controlled, resulting in low NVR (non-volatile residue). This prevents wafer oxidation, coating corrosion, and etching defects, making the gloves fully compatible with the demanding lithography processes for 8- and 12-inch wafers.
3 In-Mold Modified ESD Protection to Safeguard Electrostatic-Sensitive Wafers
Unlike commercially available anti-static gloves with temporary spray coatings, Gonars employs an in-mold anti-static modification technology on a nitrile base material. This ensures stable and uniform surface resistance, continuously dissipating static electricity throughout the entire process to prevent static buildup that could cause breakdown of photoresist and damage to precision wafer circuits. It is suitable for core lithography steps such as exposure and development.
4Flexible and Snug Fit, Suitable for Micron-Level Precision Operations
The glove material is flexible and conforms to the contours of the hand. Featuring a non-slip textured design on the fingertips, it is lightweight and non-bulky, making it ideal for precision operations such as photolithography wafer handling, equipment debugging, and precision inspection. It provides unrestricted movement and prevents slipping, effectively minimizing damage caused by accidental bumps during manual operations. Additionally, it is resistant to photolithography solvents and mild acids and alkalis, and remains durable without aging or tearing even during prolonged use.
5
✅ Double-layer vacuum-sealed packaging eliminates secondary contamination
Finished products are packaged throughout the entire process in a Class 100 cleanroom using double-layer vacuum-sealed packaging, which completely isolates them from dust and moisture during storage and transportation. There is no secondary contamination upon opening the package, allowing them to be used immediately in Class 100 lithography cleanrooms.
Post time: Jul-23-2026