In the PCB surface-mount assembly process, stencil wiping paper is a clean consumable frequently used at the printing station, yet it is also a factor affecting yield that is often overlooked. Economical single-layer wiping paper available on the market lacks sufficient fibre bonding strength; when dipped in IPA cleaning solution to wipe away solder paste residue from the underside of the stencil, it is highly prone to shedding tiny fibre particles. These ultra-fine fibres can become lodged within the apertures of fine-pitch stencils, leading to blocked apertures after prolonged production. This results in defects such as insufficient solder, bridging and solder balls. Frequent production stoppages for stencil cleaning reduce the overall production efficiency of the line and increase a company’s costs for consumables and labour.
Addressing the industry-wide challenge of fibre shedding and stencil blockages, our specialised spunlace stencil wiping paper features an optimised substrate structure, offering multiple practical advantages:
A double-layer spunlace composite structure, moulded as a single piece without excess adhesive;
Low-dust and lint-free, with minimal fibre shedding during the wiping process;
A porous structure providing strong liquid absorption and contaminant-trapping capabilities, effectively adsorbing solder paste and flux residues;
Available in multiple widths, with customisable core sizes to suit mainstream fully automatic printers such as DEK and MPM;
Excellent chemical compatibility; does not degrade or leach impurities even during prolonged contact with IPA and various cleaning solvents.
Low dust and lint-free properties are the core characteristics that distinguish high-quality SMT wiping paper from ordinary products. The product utilises filament polyester combined with a spunlace entanglement process using virgin wood pulp, without the use of chemical adhesives, ensuring the fibres remain tightly bound in both dry and wet conditions. When wiping stencils, no lint or debris is produced; fine tin residues and flux powder are trapped within the paper’s internal pores, preventing debris from remaining in the stencil apertures or dispersing throughout the cleanroom. Suitable for Class 1,000 and Class 10,000 cleanroom SMT production lines, it reduces placement defects caused by stencil blockages due to paper debris, minimises the frequency of downtime for cleaning, and stabilises production yield rates.
This dust-free wiping paper is widely used in production lines for consumer electronics, new energy circuit boards and precision chip placement. It is suitable for both semi-automatic manual wiping and continuous, reciprocating wiping on fully automatic printing machines. Customised solutions in multiple sizes can be tailored to match a company’s existing equipment, eliminating the need to replace machine models, consumables or accessories; the solvent-resistant material is tear-resistant, offering superior cleaning power with each wipe and reducing the frequency of consumable replacements over the long term.
For SMT manufacturers, the seemingly unremarkable stencil wiping paper has a direct impact on placement yield. Selecting low-dust, high-absorbency double-layer spunlace wiping paper can alleviate the problem of stencil pore blockage at source, thereby supporting standardised cleanliness management in the workshop.
Post time: Jul-20-2026